- Model NO.: Samsung-CP45FV NEO
- Automatic Production Line: Assembly
- Automation: Automation
- Mounting Head: 6
- Model No: Samsung-Cp45neo
- Specification: 1650 * 1540 * 1420
- Transmission Type: Flexible
- Certification: CE
- Production Scope: Parts Production Line
- Placement Rate: 0.178sec/Chip, 20,224 Cph
- Precision: High Precision
- Origin: China
The CP45FV Neo is a high speed, flexible placement machine.
With its unique technology it performs high speed mounting at 20,200 cph.
In addition it can place any type of components shown in the market ranging from tiny 0201 to large QFPs; from BGAs to fine pitch CSPs.
These characteristics of CP45FV provides you One-Machine solution.
|Alignment method||Full vision|
|Max. feeder capapcity||104 ea|
|PCB Size||Min.||50mm x 50mm|
|Max.||460mm x 400mm|
|Thickness||0.38mm ~ 4.2mm|
|Flying vision||CHIP||CP45 18,900 CPH (0.197sec/chip) CP45Neo20,200 CPH (0/178 sec/chip)|
|CHIP (IPC9850)||13,000 CPH/Standard 14,900 CPH/Neo|
|SOP, QFP||0.75 sec/chip|
|Fixed vision||0.5mm pitch QFP||1.6 sec/IC|
|Flying vision||Component range||0201 ~ 22mm|
|Min. lead pitch of QFP||0.5mm pitch|
|Fixed vision||Standard||~ 32mm (0.4 pitch) ~ 17mm (0.3 pitch)|
|Option for large IC||~ 42mm (0.5 pitch) ~ 32mm (0.4 pitch)|
|Option for CSP||~ 17mm (0.5 pitch)|
|Max. component height||15mm|
|Summary (standard)||0201 ~ 32mm Min. lead pitch: 0.3mm Min. ball pitch: 0.75mm|
|Summary (with option)||0201 ~ 42mm Min. lead pitch: 0.3mm Min. ball pitch: 0.5mm|
- SPEEDY : 0.197sec/chip (13,000 CPH) Flying Vision Concept
2. FLEXIBLE : Wide component coverage of 0201~ 42mm
3. RELIABLE : ±0.04mm 3 sigma accuracy for fine pitch IC
4. CONVENIENT : Easy to use and various options for fast job change-over
1. Full and detailed English guide book for you.
2. Our Engineers can be available to your factory for training if you can paid. ( Best option for you)
3. You can also take training in our factory.
4. Online service guide is experienced for us.