Gold Member Since 2016
Audited Supplier
Shenzhen CSC Electronic Equipment Co., Ltd.

Electronic Pick and Place Machine, Pick and Place Machine, 0201 BGA Placement Machine manufacturer / supplier in China, offering SMT / SMD Electronic Pick and Place Machine, Reflow Oven Soldering Use in PCB Assembly, Automatic Electronic Screwdriver Machine for Assembly Line and so on.

(/ )

SMT / SMD Electronic Pick and Place Machine

FOB Price: Get Latest Price
Min. Order: 1 Piece
Transport Package: Wood Packing
Payment Terms: T/T, Western Union
Basic Info
  • Model NO.: Samsung-CP45NEO
  • Automatic Production Line: Assembly
  • Automation: Automation
  • Mounting Head: 6
  • Model No: Samsung-Cp45neo
  • Max. Feeder Capapcity: 104
  • Specification: 1650 * 1540 * 1420
  • Transmission Type: Flexible
  • Certification: CE
  • Production Scope: Parts Production Line
  • Placement Rate: 0.178sec/Chip, 20,224 Cph
  • Precision: High Precision
  • Trademark: Samsung
  • Origin: Korea
Product Description
            SMT / SMD Electronic Pick and Place Machine

           SMT / SMD Electronic Pick and Place Machine

The CP45FV Neo is a high speed, flexible placement machine.  
With its unique technology it performs high speed mounting at 20,200 cph.  
In addition it can place any type of components shown in the market ranging from tiny 0201 to large QFPs; from BGAs to fine pitch CSPs.
These characteristics of CP45FV provides you One-Machine solution.

SMT / SMD Electronic Pick and Place Machine


Alignment methodFull vision
Max. feeder capapcity104 ea
Head6 ea
PCB SizeMin.50mm x 50mm
Max.460mm x 400mm
Thickness0.38mm ~  4.2mm
Flying visionCHIPCP45 18,900 CPH (0.197sec/chip)                                           CP45Neo20,200 CPH (0/178 sec/chip)
CHIP (IPC9850)13,000 CPH/Standard                                                                    14,900 CPH/Neo
SOP, QFP0.75 sec/chip
Fixed vision0.5mm pitch QFP1.6 sec/IC
Flying visionComponent range   0201 ~ 22mm
Min. lead pitch of QFP0.5mm pitch
Fixed visionStandard~ 32mm (0.4 pitch)                                                                                    ~ 17mm (0.3 pitch) 
Option for large IC ~ 42mm (0.5 pitch)                                                                                   ~ 32mm (0.4 pitch)
Option for CSP~ 17mm (0.5 pitch)
Max. component height15mm
Summary (standard)0201 ~ 32mm                                                                                               Min. lead pitch: 0.3mm                                                                           Min. ball pitch: 0.75mm
Summary (with option)0201 ~ 42mm                                                                                             Min. lead pitch: 0.3mm                                                                           Min. ball pitch: 0.5mm

  1. SPEEDY : 0.197sec/chip (13,000 CPH) Flying Vision Concept
            ( CP45FV Neo : 0.178sec/chip, 20,224 CPH)

     2.   FLEXIBLE : Wide component coverage of 0201~ 42mm  
     3.   RELIABLE : ±0.04mm 3 sigma accuracy for fine pitch IC
     4. CONVENIENT : Easy to use and various options for fast job change-over  

Our services:
1. Full and detailed English guide book for you.
2. Our Engineers can be available to your factory for training if you can paid. ( Best option for you)
3. You can also take training in our factory.
4. Online service guide is experienced for us.
Send your message to this supplier
Miss Olivia
Sales Manager
To: Miss Olivia

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now