Single orbit transfer:50×50~550×520mm dual orbit transfer: 50×50~550×300mm
Mitsubishi electric system
<25 um (0.025mm)
Microsoft Windows XP Professional
Visual control S
Statistical shape modeling, automatic establishment of standard image ,recognition data and error threshold
Graphical programming, with the component library, according to the component to select criteria automatically generated detection box, accurate and automatic positioning, micro fine adjustment, quickly process
option 0~2 Mark
Bar code read QR code
Reading bar code on the PCB by the device's camera
Industrial control computer, Intel dual-core CPU for 3G, DDR3 2G,HDD 500Ghard disk
Application of Inline automatic optical inspection
1. PCB testing
In the PCB detection, image contrast algorithm more applications, and to detect the main 2D, which includes data processing class (input data preliminary treatment, filtration of small pinholes and residual copper and without detectable holes, etc.) measurement type (for data input feature extraction, feature codes records, the size and location of the data were compared with standard) and topology classes (for detecting increase or missing features).
2. Solder paste print inspection
SMT solder paste printing is the initial link, but also the root cause of most of the defects, about 60% -70% of the defects in the printing stage, if the defects have been eliminated in the initial stages of production lines, can minimize losses, reduce costs, , many SMT production lines are equipped with AOI printing links detection. Printing defects There are many, can be divided into insufficient solder on the pad, excessive solder paste; solder paste large middle scratch pad, small pad edge portion paste icicles; offset printing, bridging and contamination, the formation of these defects causes include poor solder flow variability, improper stencil thickness and pore wall processing, printing parameter setting unreasonable, accuracy is not high, the blade materials and precision inappropriate choice, bad PCB processing, through AOI quality paste printing can be effectively monitored, and the number and types of defects are analyzed, thereby improving the printing process.
3. Placement inspection
Component placement part of the equipment of high precision, defects often appear tainted stickers, wrong placement, offset skew, and other polar opposite. AOI detection can monitor the above-mentioned defects and solder connections can also check the fine-pitch and BGA components pads here.
4. Reflow inspection
AOI can simply be divided into prevention and discovery issues two kinds, printing, detection and prevention classification after the patch is detected after reflow classified as development issues, in the back-end reflow test, the detection system can check the element missing, offset and skew, as well as defects all aspects of polar, also must be on the correctness and insufficient solder joints, weld defects such as short circuit and Alice feet were detected.